this is information on a product in full production. july 2013 docid024657 rev 2 1/9 9 BAL-CC25-01D3 50 ohm, conjugate ma tch to cc253x, cc254x, cc257x, cc852x, cc853x, transformer balun datasheet ? production data features ? 2.45 ghz balun with integrated matching network ? matching optimized for following chip-sets: ? cc2530, cc2531, cc2533 ? cc2540, cc2541, cc2541s ? cc2543, cc2544, cc2545 ? cc2570, cc2571 ? cc8520, cc8521 ? cc8530, cc82531 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated flip-chip on glass ? small footprint: < 0.88 mm2 benefits ? very low profile ? high rf performance ? pcb space saving versus discrete solution ? bom count reduction ? efficient manufacturability description stmicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. this has been customized for the cc25xx and cc85xx rf transceivers. it?s a design using stmicroelectronics ipd (integrated passive devi ce) technology on non- conductive glass substrate to optimize rf performance. figure 1. pin configuration (top view) figure 2. application schematic (top view) flip-chip package 4 bumps se gnd rf_n rf_p cc2530, cc2531, cc2533 cc2540, cc2541, cc2541s cc2543, cc2544, cc2545 cc2570, cc2571 cc8520, cc8521 cc8530, cc8531 power supply optional filtering rf_n rf_p se gnd rf_n rf_p z BAL-CC25-01D3 www.st.com
characteristics BAL-CC25-01D3 2/9 docid024657 rev 2 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p peak input power rf in 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 ???? air discharge) 2000 v esd ratings machine model (mm: c = 200 pf, r = 25 ???? l = 500 nh) 500 esd ratings charged device model (cdm, jesd22-c101d) 500 t op operating temperature -40 +125 oc table 2. electrical characteristics - rf performance (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to cc25xx, cc85xx ? z in nominal input impedance f frequency range (bandwidth) 2379 2507 i l insertion loss in bandwidth 0.66 db r l_se single ended return loss in bandwidth 19 db r l_diff differential ended return loss in bandwidth 19 db ? imb phase imbalance 14 a imb amplitude imbalance 0.3 db
docid024657 rev 2 3/9 BAL-CC25-01D3 ch aracteristics figure 3. insertion loss (t amb = 25 c) figure 4. return loss (t amb = 25 c) figure 5. return loss (t amb = 25 c) -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 il (db) f ( hz) g -22.5 -20 -17.5 -15 -30 rl_se ( ) db -12.5 -27.5 -10 -25 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g -22.5 -20 -17.5 -15 -30 rl_diff ( ) db -12.5 -27.5 -10 -25 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g
characteristics BAL-CC25-01D3 4/9 docid024657 rev 2 figure 6. amplitude imbalance (t amb = 25 c) figure 7. phase imbalance (t amb = 25 c) 0.0 0.1 0.2 0.3 ampl( ) db 0.4 0.5 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g 0.0 12.5 2.5 15 5 17.5 7.5 10 20.0 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g phase( eg) d
docid024657 rev 2 5/9 BAL-CC25-01D3 pack age information 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. package dimensions figure 9. pcb layout recommendation 0. mm m 94 50 0. mm 0m 94 5 500 m 255 m 40 500 m 6 m 30 60 top view 250 m 127 m gnd aperture 100 m 280 m 850 m 850 m pad diameter 250m
package information BAL-CC25-01D3 6/9 docid024657 rev 2 figure 10. footprint figure 11. marking copper pad iameter: d copper pad iameter: d 220 m recommended, 180 m min, 260 m max 220 m recommended, 180 m min, 260 m max solder stencil opening: recommended 220 m solder stencil opening: recommended 220 m line to connect copper pad on solder mask opening should be smaller than copper pad diameter solder mask opening: solder mask opening: 320 m recommendation 300 m minimum 320 m recommendation 300 m min, 340 m max (a) non solder mask (b) solder mask defined x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week)
docid024657 rev 2 7/9 BAL-CC25-01D3 pack age information figure 12. flip chip tape and reel specifications note: more information is ava ilable in the application note: an2348: ?flip chip: package descri ption and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 0.1 2.0 0.05 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.05 ? 1.55 0.10 0.73 0.05 1.0 0.05 0.20 0.015 1.0 0.05 st st st x x z y w w x x z y w w x x z y w w st st st st x x z y w w x x z y w w x x z y w w x x z y w w
ordering information BAL-CC25-01D3 8/9 docid024657 rev 2 3 ordering information 4 revision history table 3. ordering information order code marking package weight base qty delivery mode BAL-CC25-01D3 sl flip chip 1.07 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 23-may-2013 1 initial release 11-jul-2013 2 updated figure 9 .
docid024657 rev 2 9/9 BAL-CC25-01D3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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